Wafer Fabrication

Today, the ever-accelerated development of the integrated circuit industry has driven the information society to enter the era of big data, and the deep-seated technical reason why the integrated circuit industry can keep booming is precisely the upgrading of microelectronic devices as the cornerstone of integrated chips driven by Moore’s Law. The development of microelectronic device technology involves complex advanced processes and multi-level physical mechanisms. In the nanometer era, it becomes increasingly difficult to develop devices. However, by solving physical equations with the aid of computers, the device fabrication process, internal mechanism and external electrical characteristics can be simulated to obtain an optimized device design that meets related requirements, i.e., Technology Computer Aided Design (TCAD). The use of TCAD in the beforehand research and introduction of new technologies has become a common practice in IDMs and foundries. Therefore, we need to develop a device simulation tool that is physically clear with 3D simulation capability, high computing precision and high computing speed.